14 ics 1-1-3 dc/dc converter ics features ? urface-mount package (sop8) output current: 0.6a high efficiency: 75 to 80% requires only 4 discrete components internally-adjusted phase correction and output voltage adjustment performed internally built-in reference oscillator (60khz) built-in overcurrent and thermal protection circuits electrical characteristics (t a =25 c) unit v % kh z mv mv mv/ c db a parameter output voltage efficiency oscillation frequency line regulation load regulation te mperature coefficient of output voltage ripple rejection overcurrent protection starting current symbol v o conditions conditions f conditions ? v oline conditions ? v oload conditions ? v o / ? t a r rej conditions i s1 conditions absolute maximum ratings unit v w c c c/w c/w ratings 35 1 ?0 to +125 ?0 to +125 22 100 symbol v in p d t j t stg j-l j-a parameter dc input voltage power dissipation junction temperature storage temperature thermal resistance (junction to 7-pin lead) thermal resistance (junction to ambient air) *1 recommended operating conditions parameter dc input voltage range output current range operating junction temperature range symbol v in i o t jop unit v a c ratings si-8033w SI-8050W 5.3 to 28 7 to 33 0 to 0.6 ?0 to +125 *1: glass-epoxy board of 40 40mm (copper laminate area 4.3%) ratings si-8033w SI-8050W min. typ. max. min. typ. max. 3.17 3.30 3.43 4.80 5.00 5.20 v in =15v, i o =0.3a v in =20v, i o =0.3a 75 80 v in =15v, i o =0.3a v in =20v, i o =0.3a 60 60 v in =15v, i o =0.3a v in =20v, i o =0.3a 60 80 80 100 v in =8 to 28v, i o =0.3a v in =10 to 30v, i o =0.3a 20 30 30 40 v in =15v, i o =0.1 to 0.4a v in =20v, i o =0.1 to 0.4a 0.5 0.5 45 45 f=100 to 120h z f=100 to 120h z 0.61 0.61 v in =15v v in =20v surface-mount, separate excitation step-down switching mode si-8000w series applications power supplies for telecommunication equipment onboard local power supplies
15 ics si-8000w series external dimensions (sop8) block diagram sw v os v in 5 to 8 gnd 4 3 1 osc reg. ocp comp. reset drive tsd amp. v ref t ypical connection diagram v in c 1 d 1 l1 200 h 100 f c 2 330 f v in sjpb-d4 (sanken) gnd gnd si-8000w sw v os 13 4 5 to 8 + + v o gnd (unit : mm) reference data copper laminate area vs. power dissipation copper laminate area vs. thermal resistance j-a power dissipation p d (w) copper laminate area (mm 2 ) (gnd terminal) 10 100 1.2 1 0.8 0.6 0.4 0.2 0 1000 tj=100 c area of pc board : 40 40mm t a=25 c t a=50 c t a=80 c copper laminate area (mm 2 ) (gnd terminal) 10 100 140 120 100 80 60 40 1000 area of pc board : 40 40mm thermal resistance j-a ( c/w) pin assignment q v in w n.c e sw r v os t gnd y gnd u gnd i gnd plastic mold package type flammability: ul94v-0 product mass: approx. 0.1g 0.995max. 0.10 1.27 0.4 0.1 0.4 0.1 0.15 +0.1 5.1 0.4 1.27 8765 1234 4.4 0.2 1.5 0.1 1.55 0.15 0.05 0.05 6.2 0.3 0 to 1 0 0.5 0.1 ?.05 0.12 m
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